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AssigneeMultibeam Corporation
InventorsTheodore A. Prescop, Kevin M. Monahan, David K. Lam, Michael C. Smayling
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Methods, devices and systems for patterning of substrates using charged particle beams without photomasks and without a resist layer. Material can be deposited onto a substrate, as directed by a design layout database, localized to positions targeted by multiple, matched charged particle beam columns. Reducing the number of process steps, and eliminating lithography steps, in localized material addition has the dual benefit of reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Furthermore, highly localized, precision material deposition allows for controlled variation of deposition rate and enables creation of 3D structures. Local gas injectors and detectors, and local photon injectors and detectors, are local to corresponding ones of the columns, and can be used to facilitate rapid, accurate, targeted, highly configurable substrate processing, advantageously using large arrays of said beam columns.
A method for targeted addition of material onto the substrate using multiple charged particle beam columns, individual columns projecting individual charged particle beams at the substrate, comprising the actions of:
A method for targeted addition of material onto the substrate using multiple charged particle beam columns, individual columns projecting individual charged particle beams at the substrate, comprising the actions of:
Dependencies are inferred from the claim text.