Thermal lamination adhesive coatings for use on substrates
AssigneeMichelman, Inc.
InventorsD. Ryan Breese, Robin Cooper, Krist Vanderstiggel, Edward R. Gay, Richard Michelman
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Abstract
Lamination adhesives including an aqueous dispersion having a mixture of a polyamide and an ethylene acrylic acid copolymer are provided for use on a variety of substrates. In various embodiments, the aqueous dispersion is substantially free of plasticizers and non-aqueous organic solvents. Also provided is a method of forming a laminate adhesion between two substrates. The disclosure also describes a laminate structure comprising first and second substrates laminated together by the lamination adhesive, the lamination adhesive including a mixture of a polyamide and a copolymer of ethylene and acrylic acid.
Claims27
A lamination adhesive comprising:
- an aqueous dispersion comprising a mixture of polyamide and a copolymer of ethylene and acrylic acid;
- and
- an isocyanate crosslinker
- wherein the lamination adhesive is substantially free of non-aqueous plasticizers and organic solvents.
A lamination adhesive comprising:
- an aqueous dispersion comprising:
- from about 25% to about 70% by weight of a polyamide;
- from about 10% to about 30% by weight of a copolymer of ethylene and acrylic acid;
- and
- from about 0% to about 70% by weight polyurethane;
- wherein the lamination adhesive is substantially free of non-aqueous plasticizers and organic solvents.
A lamination adhesive comprising an aqueous dispersion comprising a mixture of polyamide and a copolymer of ethylene and acrylic acid;
- wherein the lamination adhesive:
- is substantially free of non-aqueous plasticizers and organic solvents;
- and
- has a Brookfield dispersion viscosity of less than about 200 cps.
Dependencies are inferred from the claim text.