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US 9,550,353 B2Granted
Apparatus and methods for micro-transfer-printing
AssigneeX-Celeprint Limited
InventorsChristopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg
Life of this patent
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Abstract
In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
Claims34
A conformable transfer device, the transfer device comprising:
- a base comprising a first material;
- a sub-base comprising a second material and disposed on the base, wherein the sub-base has a smaller cross-sectional area than the base;
- a bulk volume having a first surface and a second surface opposite the first surface, the second surface in contact with the sub-base and the base, the bulk volume comprising a material different from the first and second materials and disposed at least partly on the sub-base and at least partly on the base, wherein a thickness of a portion of the bulk volume that is disposed on the sub-base is less than a thickness of the sub-base;
- and
- a plurality of posts disposed on the first surface of the bulk volume, opposite and above the sub-base, for picking up printable material, wherein the plurality of posts, the base, the sub-base, and the bulk volume are arranged such that a force applied to a surface of the base opposite the sub-base is transmitted to the plurality of posts.
2 more elements
Dependencies are inferred from the claim text.