Electronic component assembly apparatus

An electronic component assembly apparatus that mounts an electronic component on a substrate or removes the electronic component from the substrate, the electric component including an external electrode being electrically connected to the substrate, a heat generating member formed in a same layer as a layer in which the external electrode is formed, and heating electrodes including first and second electrodes connected to the heat generating member, the electronic component assembly apparatus comprising:

• an abutting unit having a through-hole including:
• a first conductive unit that is annular and is abutted against the first electrode,
• a second conductive unit that is abutted against the second electrode and is disposed so as to be surrounded by the first conductive unit, and
• an insulating member that has an insulating property and couples the first conductive unit to the second conductive unit;
• a heater that causes the heat generating member to generate heat through the abutting unit;
• and
• a suction unit that suctions the electronic component through the through-hole in the abutting unit.