Shielding encapsulation for electrical circuitry

An electromagnetic interference shielded device, comprising:

• electrical circuitry including at least a radio-frequency module;
• an electrically non-conductive polymer-based encapsulant layer including an encapsulant-air interface, wherein the electrically non-conductive polymer-based encapsulant layer coats substantially only the radio-frequency module of the electrical circuitry;
• a conformal dielectric layer between the electrically non-conductive polymer-based encapsulant layer and the electrical circuitry;
• and
• a plurality of particles anisotropically dispersed within the electrically non-conductive polymer-based encapsulant layer such that a particle concentration along the encapsulant-air interface is higher than a particle concentration along an encapsulant-dielectric interface, the plurality of particles comprising a Nickel-Manganese (NiMn) ferrite material or polyacetylene,
• wherein the particle concentration at the encapsulant-air interface is sufficiently high to provide electromagnetic interference protection to the electrical circuitry, wherein the electrically conductive particle concentration at the encapsulant-dielectric interface is sufficiently low to provide short-circuit protection of the electrical circuitry along the encapsulate-dielectric interface.

An electromagnetic interference shielded device, comprising:

• electrical circuitry comprising at least a radio-frequency module and a digital module;
• an electrically non-conductive encapsulant layer including a substantially planar encapsulant-air interface, wherein the electrically non-conductive encapsulant layer coats substantially only at least one of the radio-frequency module or the digital module of the electrical circuitry;
• a conformal dielectric layer between the electrically non-conductive encapsulant layer and the electrical circuitry;
• and
• a plurality of particles anisotropically dispersed within the electrically non-conductive encapsulant layer such that a particle concentration along the substantially planar encapsulant-air interface is higher than a particle concentration along an encapsulant-dielectric interface, the plurality of particles comprising a Nickel-Manganese (NiMn) ferrite material or polyacetylene,
• wherein the particle concentration at the encapsulant-air interface is sufficiently high to provide electromagnetic interference protection to the electrical circuitry, wherein the particle concentration at the encapsulant-dielectric interface is sufficiently low to provide short-circuit protection of the electrical circuitry along the encapsulate-dielectric interface from the plurality of particles.