Heat receiving apparatus, cooling apparatus, and electronic apparatus

A heat receiving apparatus, comprising:

• a single semiconductor package including a plurality of electronic parts;
• a heat receiver including:
• a case, a refrigerant flows through a flow path provided at an inside of the case, and the case conducts heat from the single semiconductor package arranged outside the case to the refrigerant flowing through the flow path;
• a first valve that changes a first cross sectional area of a first portion of the flow path that corresponds to a first one of the electronic parts of the single semiconductor package;
• and
• a second valve that changes a second cross sectional area of a second portion of the flow path that corresponds to a second one of the electronic parts of the single semiconductor package, the first and second portions of the flow path are serially arranged in different portions of the flow path;
• first and second temperature sensors that detect temperatures of the first and second ones of the electronic parts of the single semiconductor package, respectively, the first temperature sensor is arranged closer to the first valve than the second valve, and the second temperature sensor is arranged closer to the second valve that the first valve;
• and
• a control unit that controls the first valve to reduce the first cross sectional area of the first part of the flow path, when a first output value of the first temperature sensor is more than a first predetermined threshold value, and the control unit that controls the second valve to reduce the second cross sectional area of the second part of the flow path, when a second output value of the second temperature sensor is more than a second predetermined threshold value.