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US 9,545,026 B2Granted
Electronic component module and an assembly including the same
AssigneePanasonic Corporation
InventorsToshiyuki Fukuda, Keisuke Kodera, Fumito Itou, Toshihiro Miyoshi
Life of this patent
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Abstract
An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do.
Claims20
An electronic component module, comprising:
- a board;
- a plurality of external terminals provided on a first surface of the board;
- a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals;
- and
- a wiring portion provided on a second surface of the board opposite to the first surface,
- wherein
- the wiring portion is electrically connected with at least one of the plurality of external terminals, and
- the first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do.
5 more elements
An electronic component module assembly, comprising:
- a mounting board on which
- an electronic component module including
- a board,
- a plurality of external terminals provided on a first surface of the board, and
- a semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals is mounted, wherein
- on a first surface of the mounting board, provided are a terminal mounting land for electrical connection with the electronic component module, and a heat dissipation portion for dissipating heat of the semiconductor chip mounted on the electronic component module, and
- an amount of protrusion of an end of the heat dissipation portion from the terminal mounting land along a normal to the first surface of the mounting board is larger than that of protrusion of ends of the external terminals from the semiconductor chip along a normal to the first surface of the board.
4 more elements
An electronic component module, comprising:
- a board;
- a plurality of external terminals provided on a first surface of the board;
- and
- a first semiconductor chip and a second semiconductor chip provided on a region on the first surface surrounded by the external terminals, wherein
- an amount of heat generation of the first semiconductor chip is larger than that of the second semiconductor chip,
- a heat generation circuit region of the first semiconductor chip is disposed along one end of the board,
- at least one of the external terminals is a heat dissipation terminal for escaping heat generated in the heat generation circuit region, and
- the heat dissipation terminal is disposed along one end near the heat generation circuit region in the board.
5 more elements
An electronic component module, comprising:
- a board;
- a plurality of external terminals provided on a first surface of the board;
- and
- a first semiconductor chip and a second semiconductor chip provided on a region on the first surface surrounded by the external terminals, wherein
- an amount of heat generation of the first semiconductor chip is larger than that of the second semiconductor chip,
- frame bodies are provided along two opposite sides of the first surface of the board, and
- the external terminals are buried in the frame bodies.
4 more elements
Dependencies are inferred from the claim text.