Multi-layer printed circuit boards with dimensional stability
AssigneeElite Material Co., Ltd.
InventorsYa-Wen Kuo, Li-Chih Yu, Ching-Hsin Ho
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Abstract
A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.
Claims10
A multi-layer printed circuit board comprising:
- a core comprising a core insulation layer and traces formed on two sides of the core insulation layer;
- a plurality of insulation layers sequentially formed at two sides of the core;
- and
- a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers;
- wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers,
- wherein the dimensional stability is selected from thermal expansion coefficient, storage modulus, stiffness, glass transition temperature or a combination thereof, and
- wherein the core insulation layer has a stiffness of greater than or equal to 5000 N/m at 250° C.
Dependencies are inferred from the claim text.