Wiring substrate and method for manufacturing wiring substrate

A wiring substrate comprising:

• an insulating layer;
• and
• a connection terminal formed on the insulating layer;
• wherein the connection terminal includes
• a metal layer formed on the insulating layer and including upper and side surfaces,
• a metal post formed on the upper surface of the metal layer and including upper and side surfaces, and
• a surface plating layer that covers the upper and side surfaces of the metal post,
• wherein the metal layer includes a material that is inactive with respect to a material included in the surface plating layer,
• wherein the metal layer has an upper surface edge part that is exposed at an outside from the side surface of the metal post in a plan view,
• wherein the surface plating layer is formed to cover the upper surface edge part and the side surface of the metal layer and
• wherein a space or spaces are formed in an area where an inner peripheral surface of the upper surface edge part and an end part of a surface of the surface plating layer face other.