Flip chip interconnect solder mask
AssigneeSTATS ChipPAC Pte. Ltd.
InventorRajendra D. Pendse
Life of this patent
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Abstract
A solder mask for flip chip interconnection has a common opening that spans a plurality of circuit elements. The solder mask allows confinement of the solder during the re-melt stage of interconnection, yet it is within common design rules for solder mask patterning. Also, a substrate for flip chip interconnection includes a substrate having the common opening that spans a plurality of circuit elements. Also, a flip chip package includes a substrate having a common opening that spans a plurality of circuit elements.
Claims10
A method of making a semiconductor device, comprising:
- providing a substrate including a surface which is non-wettable by solder;
- forming a plurality of traces over the non-wettable surface of the substrate;
- forming a masking layer over the non-wettable surface of the substrate with the traces passing beneath first and second elongated openings of the masking layer at interconnect sites and with the traces being parallel with respect to a width across the first elongated opening and being angled with respect to a width across the second elongated opening;
- disposing a semiconductor die over the substrate;
- and
- coupling the semiconductor die to the interconnect sites on the substrate.
A method of making a semiconductor device, comprising:
- providing a substrate including first and second traces formed over a surface of the substrate;
- and
- forming a masking layer over the surface of the substrate including first and second elongated openings with a first portion of the first and second traces passing beneath and being parallel with respect to a width across the first elongated opening and a second portion of the first and second traces passing beneath and being angled with respect to a width across the second elongated opening.
Dependencies are inferred from the claim text.