Dry film solder mask composite laminate materials
AssigneeInternational Business Machines Corporation
InventorsSarah K. Czaplewski, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
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Abstract
In an example, a process for bonding a dry film solder mask (DFSM) material to a printed circuit board (PCB) laminate material is disclosed. The process includes applying a DFSM material that includes a dienophile functional group to a PCB laminate material that includes a diene functional group. The process further includes bonding the DFSM material to the PCB laminate material via a chemical reaction of the dienophile functional group with the diene functional group.
Claims15
A process for forming a dry film solder mask (DFSM) composite laminate material, the process comprising:
- applying a first dry film solder mask (DFSM) material to a printed circuit board (PCB) laminate material, wherein the first DFSM material includes a diene functional group, and wherein the PCB laminate material includes a dienophile functional group;
- and
- forming a DFSM composite laminate material by bonding the first DFSM material to the PCB laminate material via a chemical reaction of the diene functional group with the dienophile functional group.
Dependencies are inferred from the claim text.