Multilayer ceramic electronic component and board having the same mounted thereon

A board having a multilayer ceramic electronic component mounted thereon, the board comprising:

• a substrate having first and second electrode pads formed on the substrate;
• and
• a multilayer ceramic electronic component mounted on the substrate,
• wherein the multilayer ceramic electronic component includes:
• a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked,
• a pair of first external electrodes disposed on first and second side surfaces of the ceramic body, respectively,
• a pair of second external electrodes disposed on the first and second side surfaces of the ceramic body, respectively,
• wherein one of the first external electrodes and one of the second external electrodes disposed on the first side surface are spaced apart from each other in a length direction of the ceramic body and extended to portions of a mounting surface of the ceramic body, and
• first and second internal electrodes alternately stacked in the ceramic body, exposed through at least one of the first and second side surfaces of the ceramic body, and connected to one of the first and second external electrodes, one of the plurality of dielectric layers being disposed between the first and second internal electrodes;
• and
• an interposer substrate including
• an insulation substrate connected to the mounting surface of the multilayer ceramic capacitor and
• first and second connection terminals disposed on the insulation substrate and having upper surfaces connected to the first and second external electrodes, respectively, and lower surfaces connected to the first and second electrode pads, respectively,
• wherein the first and second connection terminals of the interposer substrate comprise:
• first and second connection portions disposed on an upper surface of the insulation substrate so as to be connected to the first and second external electrodes, respectively;
• and
• first and second terminal portions extended from a center of the first and second connection portions to a part of a lower surface of the insulation substrate through surfaces of the insulation substrate opposing each other a length direction of the insulation substrate, respectively, and
• wherein each of the first and second connection portions extends to both opposing edges of the insulation substrate in a width direction of the insulation substrate orthogonal to the length direction of the insulation substrate, and corner parts of the insulation substrate between the first and second connection portions and the first and second terminal portions are provided with margins.