Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end

An optoelectronic module comprising at least one electronic unit for at least one of outputting and receiving electric signals and at least one optical unit for at least one of converting said electric signals into optical signals and converting said optical signals into electric signals, and

• an electrical interconnect structure for connecting the at least one electronic unit and the at least one optical unit to each other, and for providing at least one of an electrical input interface and electrical output interface for an external component,
• said interconnect structure comprising an electrically insulating substrate and a plurality of signal lead pairs to be coupled between said at least one electronic unit and a frontend contact region for electrically contacting said interconnect structure by said external component,
• said interconnect structure further comprising a ground plane layer which is electrically insulated from said plurality of signal lead pairs,
• wherein each pair of said plurality of signal lead pairs has a circuit connecting region for electrically contacting respective terminals of said at least one electronic unit, and
• wherein in a region adjacent to said respective terminals of said at least one electronic unit said ground plane layer has a plurality of clearances that are each allocated to one pair of said plurality of signal lead pairs and separated from a respective neighbouring clearance, wherein a ground plane layer web separates at least two signal lead pairs.

An active optical cable assembly, comprising at least one optoelectronic module for at least one of converting electrical signals into optical signals and converting optical signals into electrical signals, an electrical plug connector for interfacing said optoelectronic module with an external device, and an optical conductor for at least one of transmitting optical signals generated by the optoelectronic module and received by said optoelectronic module,

• said optoelectronic module comprising at least one electronic unit for at least one of outputting and receiving electric signals, at least one optical unit for at least one of converting said electrical signals into optical signals and converting said optical signals into electrical signals, and an electrical interconnect structure for connecting the at least one electronic unit and the at least one optical unit to each other, and for providing an electrical input/output interface for an external component,
• said interconnect structure comprising an electrically insulating substrate and a plurality of signal lead pairs to be coupled between said at least one electronic unit and a frontend contact region for electrically contacting said interconnect structure by said external component,
• said interconnect structure further comprising a ground plane layer which is electrically insulated from said plurality of signal lead pairs,
• wherein each pair of said plurality of signal lead pairs has a circuit connecting region for electrically contacting respective terminals of said at least one electronic unit,
• wherein in a region adjacent to said respective terminals of said at least one electronic unit said ground plane layer has a plurality of clearances that are each allocated to a respective one of said plurality of signal lead pairs and separated from a respective neighbouring clearance, wherein a ground plane layer web separates at least two signal lead pairs.