Semiconductor device and metering apparatus

A metering apparatus, comprising:

• a semiconductor device that includes:
• an oscillator;
• a semiconductor chip that includes:
• an oscillation circuit that is connected to the oscillator,
• a timer circuit that generates a timing signal of a frequency according to an oscillation frequency of the oscillation circuit,
• a frequency correction section that corrects a frequency of the timing signal based on temperature data, and
• a measurement section that measures a measurement target associated with timing data generated based on the timing signal;
• a lead frame that the oscillator and the semiconductor chip are mounted on, the lead frame having a through hole between the oscillator and the semiconductor chip,
• a bonding wire, the oscillator being electrically connected to the semiconductor chip through the bonding wire via the through hole,
• wherein the oscillator and the semiconductor chip are contained within a single package,
• wherein the lead frame has opposite first and second main faces which are respectively on opposite first and second main face sides of the lead frame,
• the bonding wire is connected to a terminal portion of the oscillator that is exposed to the second main face side, and
• the bonding wire penetrates through the through hole to connect to the terminal portion of the oscillator.

A semiconductor device comprising:

• an oscillator;
• a semiconductor chip that includes:
• an oscillation circuit that is connected to the oscillator,
• a timer circuit that generates a timing signal of a frequency according to an oscillation frequency of the oscillation circuit, and
• a frequency correction section that corrects a frequency of the timing signal based on temperature data;
• and
• a lead frame that the oscillator and the semiconductor chip are mounted on, the lead frame having a through hole between the oscillator and the semiconductor chip, wherein
• the oscillator and the semiconductor chip are contained within a single package, wherein:
• the oscillator is mounted on a first main face of the lead frame,
• the semiconductor chip is mounted on a second main face of the lead frame that is on a second main face side that is the opposite side of the lead frame to the first main face,
• the through hole is included between the oscillator and the semiconductor chip in a direction that intersects with the first main face and the second main face,
• the through hole of the lead frame exposes a terminal portion of the oscillator to the second main face side, and
• the semiconductor device further comprises a bonding wire connected to the terminal portion of the oscillator that is exposed to the second main face side through the through hole.