US 9,543,915 B1 · Stacked active RF circuits including in-situ bias monitoring systems and methods

Abstract

Systems and methods according to one or more embodiments are provided for stacked active RF circuits implemented as amplification stages in high gain phased array antenna systems. Stacked active RF circuits may be implemented, for example, as an amplification stage of an element electronic circuit. Stacked active RF circuits may be implemented, for example, as a second amplification stage to maintain amplification in a high gain phased array antenna system. In one example, a system comprises a substrate comprising a plurality of substrate layers and one or more input ports and output ports. A plurality of amplification stages comprising a plurality of amplifiers, attenuators, and phase shifters are integrated within the plurality of substrate layers, the amplification stage coupled between the input and output ports. One or more monitor circuits are coupled to the plurality of amplification stages. Additional systems and methods are also provided.

Claims18

Dependent claims

A system comprising:

a substrate comprising a plurality of substrate layers;
one or more input ports and output ports;
a plurality of amplification stages comprising a plurality of amplifiers, attenuators, and phase shifters integrated within the plurality of substrate layers, the amplification stages coupled between the input and output ports, wherein:
a sum of a direct current consumed by the plurality of amplifiers integrated within each substrate layer is approximately equal;
the plurality of amplifiers are radio frequency (RF) amplifiers;
the plurality of attenuators are RF attenuators coupled to the plurality of amplifiers and/or phase shifters;
and
the plurality of phase shifters are RF phase shifters coupled to the plurality of amplifiers and/or attenuators;
and
one or more monitor circuits coupled to the plurality of amplification stages.

7 more elements

A system comprising:

an element array comprising:
a substantially planar circuit board;
a plurality of antenna elements integrated in the circuit board;
a plurality of receive element circuits coupled to the circuit board wherein each receive element circuit is coupled to a corresponding one of the plurality of antenna elements to receive an RF signal at an input port and configured to provide an amplification and phase shift to the RF signal;
a plurality of combiner circuits integrated in the circuit board and coupled to the plurality of receive element circuits, adapted to combine the plurality of amplified and phase shifted RF signals to form a combined RF signal;
and
one or more substrates, each of the substrates comprising:
a distributed gain circuit coupled to the plurality of combiner circuits to receive the combined RF signal at an input port and configured to provide an amplification to the combined RF signal;
and
a selectable signal delay circuit coupled to the distributed gain circuit to receive the amplified combined RF signal at an input port and configured to provide a delay to the amplified combined RF signal at an output port;
and
a connector coupled to each of the one or more substrates selectable signal delay circuit output ports.

9 more elements

Dependencies are inferred from the claim text.

Stacked active RF circuits including in-situ bias monitoring systems and methods

Life of this patent

Stacked active RF circuits including in-situ bias monitoring systems and methods

Life of this patent

Abstract

Claims18