Optoelectronic packages having through-channels for routing and vacuum

A stacked optoelectronic packaged device, comprising:

• a plurality of stacked components within a package comprising a package material having a package body providing side walls and a bottom wall for said package, and a lid for sealing a top of said package, said plurality of stacked components including:
• a first cavity die having a cavity, a top surface, and a bottom surface including a through-channel formed in said bottom surface, the through-channel extending from the cavity to an outer edge of the first cavity die;
• a bottom die having a top surface including thereon an electrical trace and a light source die for emitting light coupled to said electrical trace, wherein the electrical trace extends on the top surface of the bottom die from a bond pad within the cavity to a bond pad outside of the outer edge of the first cavity die;
• wherein said through-channels of said first cavity die is aligned to said electrical trace;
• wherein said first cavity die is bonded to said bottom die;
• wherein said electrical trace is within said through-channel and not contacting said first cavity die,
• an optics die on said first cavity die;
• a sealing die on said optics die
• a second cavity die on said sealing die, and
• a photodetector (PD) die optically coupled to receive said light originating from said light source die.

A method of forming a packaged stacked optoelectronic device, comprising:

• positioning a bottom die on a bottom wall of a package comprising a package material having a package body providing side walls and said bottom wall, said bottom die having a top surface including an electrical trace and a light source die for emitting light thereon;
• positioning a first cavity die having a cavity, a top surface and a bottom surface including a through-channel formed in said bottom surface on said top surface of said bottom die so that said through-channel is aligned to said electrical trace, the electrical trace extending on the top surface of the bottom die from a bond pad within the cavity to a bond pad outside of a perimeter of the first cavity die;
• bonding said first cavity die to said bottom die, wherein said electrical trace is within said through-channel and not contacting said first cavity die;
• positioning a photodetector (PD) die in a location to be coupled to receive said light originating from said light source die;
• creating a vacuum within said package, and
• sealing a lid on a top of said side walls for sealing said package under said vacuum.