Deposition donor substrate and method for manufacturing light-emitting device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsSatoshi Seo, Kohei Yokoyama
Life of this patent
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Abstract
One surface of a first substrate provided with at least light-absorbing layers separately formed, partition layers each formed between the light-absorbing layers and having an inverse taper shape, and material layers formed on the light-absorbing layers and on the partition layers so that the material layers are separated from each other is disposed to face a deposition target surface of a second substrate; light irradiation is performed from the other surface of the first substrate, only the material layers in regions overlapped with the light-absorbing layers are heated and evaporated to the deposition target surface of the second substrate.
Claims22
A method for manufacturing a light-emitting device, comprising the steps of:
- disposing one surface of a first substrate to face a deposition target surface of a second substrate, wherein the first substrate comprises a light-absorbing layer, a material layer on the light-absorbing layer, and first and second partition layers;
- and
- heating the material layer by irradiating the light-absorbing layer with light from the other surface of the first substrate so that the material is evaporated to the deposition target surface of the second substrate,
- wherein each of thicknesses of the first and second partition layers is larger than the sum of a thickness of the light-absorbing layer and a thickness of the material layer.
A method for manufacturing a light-emitting device, comprising the steps of:
- disposing one surface of a first substrate to face a deposition target surface of a second substrate, wherein the first substrate comprises at least light-absorbing layers separated from each other, partition layers each formed between the light-absorbing layers and having an inverse taper shape, reflective layers formed on the light-absorbing layers and on the partition layers so that the reflective layers are separated from each other, and material layers separated from each other on the light-absorbing layers and on the partition layers with the reflective layers interposed therebetween;
- performing light irradiation from the other surface of the first substrate;
- heating the material layers in regions overlapped with the light-absorbing layers;
- and
- evaporating the material layers in regions overlapped with the light-absorbing layers to the deposition target surface of the second substrate.
A method for manufacturing a light-emitting device, comprising the steps of:
- disposing one surface of a first substrate to face a deposition target surface of a second substrate, wherein the first substrate comprises a light-absorbing layer, a material layer on the light-absorbing layer, and first and second partition layers;
- and
- heating the material layer by irradiating the light-absorbing layer with light from the other surface of the first substrate so that the material is evaporated to the deposition target surface of the second substrate,
- wherein the material layer is between the first and second partition layers,
- wherein each of the first and second partition layers comprises a photocurable resin or a thermosetting resin.
Dependencies are inferred from the claim text.