Optoelectronic component and method for the production thereof

A method for producing an optoelectronic component, the method comprising:

• forming an optoelectronic layer structure comprising a functional layer structure above a carrier,
• forming a frame structure comprising a first metallic material on the optoelectronic layer structure in such a way that a region above the functional layer structure is free of the frame structure and that the frame structure surrounds the region,
• forming an adhesion layer comprising a second metallic material above a covering body,
• applying a liquid first alloy to the optoelectronic layer structure and/or to the adhesion layer of the covering body in the region,
• coupling the covering body to the optoelectronic layer structure in such a way that the adhesion layer is coupled to the frame structure and the liquid first alloy is in direct physical contact with the adhesion layer and the frame structure, and
• reacting at least part of the first alloy chemically with the metallic materials of the frame structure and the adhesion layer, as a result of which at least one second alloy is formed which solidifies and thus fixedly connects the covering body to the optoelectronic layer structure.