Magnatoresistive structure and method for forming the same
AssigneeVoltafield Technology Corporation
InventorsFu-Tai Liou, Chien-Min Lee, Nai-Chung Fu
Life of this patent
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Abstract
A magnetoresistive structure includes a substrate and a patterned stack structure. The substrate has a back surface and a front surface having a step portion. The patterned stack structure is on the step portion of the front surface and comprises a magnetoresistive layer, a conductive cap layer and a dielectric hard mask layer. The step portion has a top surface parallel to the back surface, a bottom surface parallel to the back surface and a step height joining the top surface and bottom surface and being not parallel to the back surface.
Claims9
A method for forming a magnetoresistive structure, comprising:
- providing a substrate with a back surface and a front surface having a step portion;
- blanketly forming a stacked structure on the front surface of the substrate, wherein the stacked structure has a magnetoresistive layer, a conductive cap layer and a dielectric hard mask layer;
- etching the dielectric hard mask layer to form an etched dielectric hard mask layer;
- etching the conductive cap layer and the magnetoresistive layer using the etched dielectric hard mask layer as a mask to form an etched stacked structure, wherein the etched stacked structure has an etched magnetoresistive layer in direct contact with the step portion, an etched conductive cap layer and an etched dielectric hard mask layer, wherein each of the etched magnetoresistive layer, the etched conductive cap layer and the etched dielectric hard mask layer has a first horizontal portion, a non-horizontal portion not parallel to the back surface and a second horizontal portion and spans across the step portion;
- and
- forming a passivation layer covering all of the etched magnetoresistive layer, the etched conductive cap layer and the etched dielectric hard mask layer.
Dependencies are inferred from the claim text.