Packaging for thermoelectric subcomponents

A thermoelectric semiconducting assembly comprising:

• a first plate and a second plate, said first plate and said second plate being parallel and being spaced apart, said first plate having an exterior surface and an interior surface, said second plate having an exterior surface and an interior surface, said interior surface of said first plate facing said interior surface of said second plate, said plates being fabricated from a glass material;
• a plurality of pellets fitted into said first plate, each said pellet comprising a core, a first cap, and a second cap, said core including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, said pellets fitted into said first plate such that said first cap of said pellet is oriented toward said exterior surface of said first plate and said second cap of said pellet is oriented toward said interior surface of said first plate and protrudes from said interior surface of said first plate, wherein said first cap includes aluminum nitride or beryllium oxide;
• and
• a plurality of pellets fitted into said second plate, each said pellet comprising a core, a first cap, and a second cap, said core including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, said pellets fitted into said second plate such that said first cap of said pellet is oriented toward said exterior surface of said second plate and said second cap of said pellet is oriented toward said interior surface of said second plate and protrudes from said interior surface of said second plate, each said pellet in said second plate being connected to a pellet in said first plate, wherein said first cap includes aluminum nitride or beryllium oxide.

A thermoelectric semiconducting assembly comprising:

• a first plate and a second plate, said first plate and said second plate being parallel and being spaced apart, said first plate having an exterior surface and an interior surface, said second plate having an exterior surface and an interior surface, said interior surface of said first plate facing said interior surface of said second plate, said plates being fabricated from a glass material;
• a plurality of pellets fitted into said first plate, each said pellet comprising a core, a first cap, and a second cap, said core including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, said pellets fitted into said first plate such that said first cap of said pellet is oriented toward said exterior surface of said first plate and said second cap of said pellet is oriented toward said interior surface of said first plate and protrudes from said interior surface of said first plate, wherein said first cap includes powderized tungsten infiltrated with copper;
• and
• a plurality of pellets fitted into said second plate, each said pellet comprising a core, a first cap, and a second cap, said core including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, said pellets fitted into said second plate such that said first cap of said pellet is oriented toward said exterior surface of said second plate and said second cap of said pellet is oriented toward said interior surface of said second plate and protrudes from said interior surface of said second plate, each said pellet in said second plate being connected to a pellet in said first plate, wherein said first cap includes powderized tungsten infiltrated with copper.

A thermoelectric semiconducting assembly comprising:

• a first plate and a second plate, said first plate and said second plate being parallel and being spaced apart, said first plate having an exterior surface and an interior surface, said second plate having an exterior surface and an interior surface, said interior surface of said first plate facing said interior surface of said second plate, said plates being fabricated from a glass material;
• a plurality of pellets fitted into said first plate, each said pellet comprising a core, a first cap, and a second cap, said core including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, said pellets fitted into said first plate such that said first cap of said pellet is oriented toward said exterior surface of said first plate and said second cap of said pellet is oriented toward said interior surface of said first plate and protrudes from said interior surface of said first plate, wherein said first cap includes nickel, and
• a plurality of pellets fitted into said second plate, each said pellet comprising a core, a first cap, and a second cap, said core including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, said pellets fitted into said second plate such that said first cap of said pellet is oriented toward said exterior surface of said second plate and said second cap of said pellet is oriented toward said interior surface of said second plate and protrudes from said interior surface of said second plate, each said pellet in said second plate being connected to a pellet in said first plate, wherein said first cap includes nickel.

A thermoelectric semiconducting assembly comprising:

• a first plate and a second plate, said first plate and said second plate being parallel and being spaced apart, said first plate having an exterior surface and an interior surface, said second plate having an exterior surface and an interior surface, said interior surface of said first plate facing said interior surface of said second plate, said plates being fabricated from a glass material;
• a plurality of pellets fitted into said first plate, each said pellet comprising a core, a first cap, and a second cap, said core including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, said pellets fitted into said first plate such that said first cap of said pellet is oriented toward said exterior surface of said first plate and said second cap of said pellet is oriented toward said interior surface of said first plate and protrudes from said interior surface of said first plate, wherein said first cap includes an alloy of nickel, iron, and cobalt;
• and
• a plurality of pellets fitted into said second plate, each said pellet comprising a core, a first cap, and a second cap, said core including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, said pellets fitted into said second plate such that said first cap of said pellet is oriented toward said exterior surface of said second plate and said second cap of said pellet is oriented toward said interior surface of said second plate and protrudes from said interior surface of said second plate, each said pellet in said second plate being connected to a pellet in said first plate, wherein said first cap includes an alloy of nickel, iron, and cobalt.