Light emitting device

A light emitting device comprising:

• a body;
• a heat radiation plate disposed on the body and having a circular shape;
• first and second metallic layers disposed at a circumference of the heat radiation plate and having a first bonding area region a second bonding region spaced apart from the heat radiation plate;
• a plurality of light emitting parts on the heat radiation plate;
• and
• a molding member on the heat radiation plate to cover the light emitting parts,
• wherein each of the light emitting parts includes a plurality of light emitting chips connected with each other, and a plurality of wires to electrically connect the light emitting chips with the first and second bonding areas, and
• wherein straight line that pass through both ends of the wires are disposed in a radial direction with respect to a central axis of the heat radiation plate,
• wherein the light emitting parts include a first light emitting part disposed in a first region of the heat radiation plate and a second light emitting part disposed in a second region of the heat radiation plate,
• wherein the first light emitting part comprises:
• a first light emitting chip adjacent to the first metal layer;
• a second light emitting chip adjacent to the second metal layer;
• a plurality of third light emitting chips connected between the first light emitting chip and the second light emitting chip;
• a first wire connected between the first light emitting chip and the first bonding region of the first metal layer;
• and
• a second wire connected between the second light emitting chip and the second bonding region of the second metal layer,
• wherein a first straight line passing through both ends of the first wire is not parallel to a second straight line passing through both ends of the second wire,
• wherein the third light emitting chips comprise at least three light emitting chips connected with each other in series between the first and second light emitting chips, and at least one of the light emitting chips is arranged in parallel to a straight line passing through centers of the first and second light emitting chips, and
• wherein at least one of the wires has a highest point located higher than a highest point of the wire connected with the third light emitting chips.