Diodes with multiple junctions

A diode comprising:

• a semiconductor substrate having a surface;
• a first contact region disposed at the surface of the semiconductor substrate and having a first conductivity type;
• a second contact region disposed at the surface of the semiconductor substrate, laterally spaced from the first contact region, and having a second conductivity type,
• a buried region disposed in the semiconductor substrate, the buried region vertically adjacent to the first contact region, the buried region having the second conductivity type, and electrically connected with the second contact region;
• an isolation region disposed at the surface of the semiconductor substrate between the first contact region and the second contact region;
• and
• a separation region disposed at the surface of the semiconductor substrate between the first contact region and the isolation region, the separation region formed from a portion of first well region disposed in the semiconductor substrate that extends to the surface.