Magnetoresistive random access memory devices and methods of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSeung-Pil Ko, Myoung-Su Son, Kil-Ho Lee
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AssigneeSamsung Electronics Co., Ltd.
InventorsSeung-Pil Ko, Myoung-Su Son, Kil-Ho Lee
Estimating the term…
An MRAM device comprises an insulating interlayer comprising a flat first upper surface on a first region and a second region of a substrate. A pattern structure comprising pillar-shaped magnetic tunnel junction (MTJ) structures and a filling layer pattern between the MTJ structures is formed on the insulating interlayer of the first region. The pattern structure comprises a flat second upper surface that is higher than the first upper surface. Bit lines are formed on the pattern structure that contact top surfaces of the MTJ structures. An etch-stop layer is formed on the pattern structure between the bit lines of the first region and the first upper surface of the first insulating interlayer of the second region. A first portion of an upper surface of the etch-stop layer on the first region is higher than a second portion of the upper surface of the etch-stop layer on the second region.
A magnetoresistive random access memory device, comprising:
A magnetoresistive random access memory device, comprising:
A magnetoresistive random access memory device, comprising:
Dependencies are inferred from the claim text.