Backlight image sensor chip having improved chip driving performance
AssigneeSiliconfile Technologies Inc.
InventorsKyoung-Sik Park, Heui Gyun Ahn, Min-Suk Ko, Gab-Hwan Cho
Life of this patent
Estimating the term…
Abstract
The present invention relates to a backlight image sensor chip having improved chip driving performance, in which a region other than a pad region, on which a conductive pad is formed, and a sensing region, on which an optical filter is formed, is used as a region for auxiliary driving so that additional functions such as auxiliary power supply, auxiliary signal transmission and auxiliary operation control can be performed, without additional process, in the backlight image sensor chip having a restricted area, thereby improving the chip driving performance.
Claims12
A backlight image sensor having improved chip driving performance, which includes an element stacked unit having a semiconductor substrate, a semiconductor circuit module formed on a front side of the semiconductor substrate, an image sensor module and an interlayer insulation layer, an insulation multi-layer formed on a back side of the semiconductor substrate, a conductive pad formed on a portion of the back side of the insulation multi-layer, and a coupling unit electrically coupled between the conductive pad and the semiconductor circuit module of the element stacked unit, comprising:
- at least one routing metal formed in a region of a same layer as the conductive pad, and being electrically coupled to and directly contacting the conductive pad;
- at least one auxiliary driving unit formed in the element stacked unit or the insulation multi-layer;
- and
- an auxiliary coupling unit being electrically coupled between the at least one routing metal and the at least one auxiliary driving unit.
Dependencies are inferred from the claim text.