Stress released image sensor package structure and method

A sensor package, comprising:

• a first substrate with opposing first and second surfaces,
• a plurality of photo detectors formed on or under the first surface of the first substrate and configured to generate one or more signals in response to light incident on the first surface of the first substrate,
• a plurality of contact pads formed at the first surface of the first substrate and which are electrically coupled to the plurality of photo detectors,
• a plurality of holes each formed into the second surface of the first substrate and extending through the first substrate to one of the contact pads, and
• conductive leads each extending from one of the contact pads, through one of the plurality of holes, and along the second surface of the first substrate, wherein the conductive leads are insulated from the first substrate;
• one or more trenches formed into a periphery portion of the first substrate each extending from the second surface to the first surface;
• and
• insulation material covering sidewalls of the one or more trenches.