Semiconductor device and method of manufacturing the same
AssigneeSK hynix Inc.
InventorTae Kyung Kim
Life of this patent
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Abstract
A semiconductor device includes interlayer insulating films spaced apart from each other and stacked over each other, and wherein first ends of the interlayer insulating films form a stepped structure; a slit penetrating the interlayer insulating films and dividing the interlayer insulating films into a plurality of stack structures; line patterns arranged between adjacent interlayer insulating films and separated from each other by the slit; pad patterns connected to the line patterns, formed over the first ends of the interlayer insulating films, and separated from each other by the slit; and at least one punch prevention pattern formed over sidewalls of the pad patterns adjacent to the slit and formed over the first ends of the interlayer insulating films.
Claims20
A semiconductor device, comprising:
- interlayer insulating films spaced apart from each other and arranged in a stack, wherein first ends of the interlayer insulating films form a stepped structure;
- a slit penetrating the interlayer insulating films and dividing the interlayer insulating films into a plurality of stack structures;
- line patterns arranged between adjacent interlayer insulating films;
- pad patterns connected to the line patterns and formed over the first ends of the interlayer insulating films, wherein the pad patterns are formed of a conductive material;
- and
- at least one punch prevention pattern formed over the first ends of the interlayer insulating films, the punch prevention pattern having a surface facing sidewalls of the pad patterns.
A semiconductor device, comprising:
- a memory cell stack provided in a cell region;
- a line pattern extending from the memory cell stack to a contact region in a first direction;
- a pad pattern extending from the line pattern and provided in the contact region, wherein the pad pattern is formed of a conductive material;
- a punch prevention pattern extending from the pad pattern in a second direction perpendicular to the first direction and provided in the contact region;
- and
- a contact plug being in contact with an upper surface of the pad pattern and an upper surface of the punch prevention pattern.
Dependencies are inferred from the claim text.