Optical sensor package

An optical package comprising:

• a first substrate having a first surface, a pad located on the first surface of the substrate;
• a processor die having a pad, the processor die coupled to the first surface of the first substrate;
• encapsulation material around the processor die, the encapsulation material over the processor die including a recess;
• a second substrate in the recess of the encapsulation material, the second substrate having a first surface;
• a first optical device coupled to the first surface of the second substrate;
• a second optical device located above the encapsulation material;
• and
• a cap located around side surfaces of the first and second optical devices and having sidewalls and an innerwall, the innerwall optically separating the first optical device from the second optical device.

A method of making an optical package, the method comprising:

• coupling a processor die to a first surface of a first substrate;
• encapsulating the processor die with encapsulation material;
• securing a second substrate to a surface of the encapsulation material, the second substrate being located above the processor die;
• securing first and second optical devices to the second substrate, the first optical device being spaced apart from the second optical device by a distance;
• and
• using an adhesive material, coupling an innerwall of a cap to the second substrate between the first and second optical devices and coupling sidewalls of the cap to the first surface of the first substrate, the cap having a first opening above the first optical device and a second opening above the second optical device.

An electronic device comprising:

• a microprocessor;
• and
• an optical package, the optical package including:
• a first substrate having a first surface, a pad located on the first surface of the first substrate;
• a processor die having a pad, the processor die coupled to the first surface of the first substrate;
• first conductive connectors coupling the pad of the first substrate to the pad of the processor die;
• encapsulation material over the processor die;
• a light-emitting diode die stacked relative to the processor die;
• a light-receiving diode die stacked relative to the processor die;
• a second conductive connector coupling the light-emitting diode die to the first substrate and a third conductive connector coupling the light-receiving diode die to the first substrate;
• and
• a cap located around side surfaces of the light-emitting diode die and the light-receiving diode die, the cap having sidewalls and an innerwall, the innerwall optically separating the light-emitting diode die from the light-receiving diode die to form a first open cavity and a second open cavity, the light-emitting diode die and the second conductive connector located in the first open cavity and the light-receiving diode die and the third conductive connector located in the second open cavity.