US 9,543,277 B1Granted

Wafer level packages with mechanically decoupled fan-in and fan-out areas

AssigneeInvensas Corporation

InventorsBongsub Lee, Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Akash Agrawal, Kyong-Mo Bang, Gabriel Z. Guevara, Xuan Li, Long Huynh

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Abstract

A fan-out microelectronic package is provided in which bond wires electrically couple bond pads on a microelectronic element, e.g., a semiconductor chip which may have additional traces thereon, with contacts at a fan-out area of a dielectric element adjacent an edge surface of the chip. The bond wires mechanically decouple the microelectronic element from the fan-out area, which can make the electrical interconnections less prone to reliability issues due to effects of differential thermal expansion, such as caused by temperature excursions during initial package fabrication, bonding operations or thermal cycling. In addition, mechanical decoupling provided by the bond wires may also remedy other mechanical issues such as shock and possible delamination of package elements.

Claims20

Dependent claims

A fan-out microelectronic package, comprising:

a microelectronic element having a face defining a plane, a plurality of bond pads at the face, and a plurality of edge surfaces each extending in a direction transverse to the plane;
a dielectric element including a monolithic dielectric region of molded dielectric material or glass, the dielectric element having one or more edge surfaces each juxtaposed with or contacting a corresponding edge surface of the microelectronic element, a plurality of terminals and contacts at a major surface of the dielectric element overlying the monolithic dielectric region, each terminal configured to connect with a component external to the package, the terminals coupled with the contacts through traces supported on the dielectric element;
and
a plurality of bond wires of extruded metal wire each having a first end joined with a bond pad of the plurality of bond pads and a second end joined with a contact of the plurality of contacts and crossing over the corresponding edge surfaces of the microelectronic element and the dielectric element, wherein at least some of the terminals are electrically coupled with at least some of the bond pads through the bond wires.

1 more element

A method of making a fan-out microelectronic package, comprising:

forming a plurality of bond wires of extruded metal wire each joined to a bond pad at a face of a microelectronic element and to a contact at a major surface of a dielectric element, the microelectronic element and the dielectric element positioned relative to one another such that an edge surface of the dielectric element is juxtaposed with a corresponding edge surface of the microelectronic element with a gap between the juxtaposed edge surfaces, each bond wire extending across the juxtaposed edge surfaces of the microelectronic element and the dielectric element,
wherein a plurality of terminals at the major surface of the dielectric element are electrically coupled with the contacts and configured to connect with a component external to the package, at least some of the terminals are electrically coupled with the bond pads through the contacts and the bond wires, wherein the dielectric element includes a monolithic dielectric region of molded dielectric material or glass, and the plurality of terminals and contacts overlie the monolithic dielectric region.

Dependencies are inferred from the claim text.