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US 9,543,275 B2Granted
Semiconductor package with a lead, package-on-package device including the same, and mobile device including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYun-rae Cho, Jong-oh Kwon
Life of this patent
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Abstract
A semiconductor package includes a substrate; a first semiconductor chip arranged on the substrate; a second semiconductor chip arranged on the first semiconductor chip; a lead attached to the second semiconductor chip on a side of the second semiconductor chip opposite a side of the second semiconductor chip facing the first semiconductor chip; and a molding member covering an upper surface of the substrate and side surfaces of the lead and sealing the first semiconductor chip and the second semiconductor chip.
Claims5
A package-on-package device comprising:
- a memory package comprising:
- a first semiconductor chip arranged on a substrate;
- a second semiconductor chip arranged on the first semiconductor chip;
- a lead attached to the second semiconductor chip on a side of the second semiconductor chip opposite a side of the second semiconductor chip facing the first semiconductor chip;
- and
- a molding member covering an upper surface of the substrate and side surfaces of the lead and sealing the first semiconductor chip and the second semiconductor chip;
- a system semiconductor package comprising a logic chip arranged on a system semiconductor substrate;
- and
- a semiconductor package having a structure in which the memory package and the system semiconductor package are stacked.
6 more elements
A semiconductor package comprising:
- a substrate;
- a first semiconductor chip stacked on the substrate;
- a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the first semiconductor chip;
- a molding member disposed between the first semiconductor chip and the second semiconductor chip;
- and
- a lead stacked on the second semiconductor chip on a side of the second semiconductor chip opposite the molding member;
- wherein a width of the lead is less than that of the second semiconductor chip.
4 more elements
Dependencies are inferred from the claim text.