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US 9,543,271 B2Granted
Semiconductor device having a sealing layer covering a semiconductor memory unit and a memory controller
AssigneeKabushiki Kaisha Toshiba
InventorsManabu Matsumoto, Akira Tanimoto, Isao Ozawa
Life of this patent
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Abstract
A semiconductor device includes a substrate, a semiconductor memory unit mounted on a surface of the substrate, a memory controller configured to control the semiconductor memory unit and mounted on the surface of the substrate adjacent to the semiconductor memory unit, and a sealing layer disposed on the surface of the substrate and covering the semiconductor memory unit and the memory controller.
Claims20
A semiconductor device comprising:
- a substrate including a host interface on an edge thereof;
- a semiconductor memory unit mounted on a surface of the substrate;
- a memory controller configured to control the semiconductor memory unit and mounted on the surface of the substrate adjacent to the semiconductor memory unit, the memory controller including a host interface section configured to receive data from and transmit data to the host interface, the host interface section being positioned adjacent to an edge of the memory controller that faces said edge of the substrate;
- and
- a sealing layer disposed on the surface of the substrate and covering the semiconductor memory unit and the memory controller.
2 more elements
A method for manufacturing a semiconductor device, comprising:
- disposing a semiconductor memory unit on a surface of a substrate;
- disposing a memory controller on the surface of the substrate, the semiconductor memory unit and the memory controller being adjacent to each other;
- and
- forming a sealing layer on the surface of the substrate so as to cover the semiconductor memory unit and the memory controller, wherein
- the substrate includes a host interface on an edge thereof,
- the memory controller includes a host interface section configured to receive data from and transmit data to the host interface, along an edge of the memory controller, and
- the memory controller is disposed, such that the edge of the memory controller faces said edge of the substrate.
4 more elements
Dependencies are inferred from the claim text.