Multi-device package and manufacturing method thereof

A multi-device package, comprising:

• at least two device regions disposed in a substrate;
• a first redistribution layer disposed on the substrate;
• an external chip disposed on the first redistribution layer and at least electrically connected to the two device regions by the first redistribution layer;
• a second redistribution layer disposed below the substrate;
• and
• a conductive contact through the device region to interconnect the second redistribution layer and the device region.

A process of manufacturing a multi-device package, comprising:

• providing a wafer having a first surface and a second surface opposite to the first surface, and the wafer having at least two device regions therein;
• forming a first redistribution layer on the first surface, and the first redistribution layer being electrically connected to the two device regions;
• forming a plurality of first connectors on the first redistribution layer;
• mounting an external chip on the first connectors, and the external chip being at least electrically connected to the two device regions by the first redistribution layer and the first connectors;
• and
• forming a conductive contact extending from the second surface to the first surface, and the conductive contact being electrically connected to the device regions.