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US 9,543,260 B2Granted
Segmented bond pads and methods of fabrication thereof
AssigneeInfineon Technologies AG
InventorsAlbert Birner, Helmut Brech, Matthias Zigldrum
Life of this patent
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Abstract
In accordance with an embodiment of the present invention, a semiconductor device includes a first bond pad disposed at a first side of a substrate. The first bond pad includes a first plurality of pad segments. At least one pad segment of the first plurality of pad segments is electrically isolated from the remaining pad segments of the first plurality of pad segments.
Claims31
A semiconductor device comprising:
- a first bond pad disposed at a first side of a substrate, the first bond pad comprising a first plurality of conductive pad segments, wherein each of the conductive pad segment of the first plurality of conductive pad segments is electrically isolated from the remaining conductive pad segments of the first plurality of pad segments, wherein one of the first plurality of conductive pad segments is larger in area than the remaining conductive pad segments of the first plurality of conductive pad segments, and wherein top surfaces of all of the plurality of conductive pad segments are coplanar.
A semiconductor device comprising:
- a first bond pad disposed at a first side of a substrate, the first bond pad comprising a first portion and a second portion comprising a first plurality of conductive pad segments, wherein the first portion of the first bond pad is electrically coupled to the substrate, wherein the second portion of the first bond pad is electrically isolated from the substrate, wherein a contact area of the first portion is larger than a contact area of each of pad segments of the second portion, and wherein a top surface of the first portion and a top surface of the second portion are coplanar.
A semiconductor device comprising:
- a semiconductor chip having a first side;
- a first bond pad disposed at the first side of the semiconductor chip, the first bond pad comprising a first portion comprising a single pad segment and a second portion, the second portion comprising a first plurality of conductive pad segments, wherein a pad segment of the first plurality of conductive pad segments is electrically isolated from the remaining pad segments of the first plurality of conductive pad segments and electrically isolated from the single pad segment of the first portion;
- and
- a first external interconnect contacting the first portion of the first bond pad, wherein a pad segment of the first plurality of conductive pad segments is electrically coupled to the single pad segment of the first portion only through the first external interconnect.
1 more element
A semiconductor device comprising:
- a semiconductor chip comprising a substrate and having a first side;
- a first bond pad disposed at the first side of the semiconductor chip, the first bond pad comprising a first portion and a second portion separated from the first portion, wherein the first portion comprises a first plurality of conductive pad segments, wherein the second portion comprises a second plurality of conductive pad segments, wherein each of the first plurality of conductive pad segments of the first bond pad is electrically coupled to the substrate, and wherein each of the second plurality of conductive pad segments of the first bond pad is electrically isolated from the substrate;
- and
- a first interconnect contacting the first portion, wherein a pad segment of the first plurality of conductive pad segments is electrically coupled to another pad segment of the first portion only through the first interconnect.
1 more element
Dependencies are inferred from the claim text.