Method for shaping a laminate substrate

A method, comprising:

• characterizing a laminate substrate for warpage characteristics by using one of room temperature techniques and elevated temperature techniques;
• determining a horizontal plane distortion based on the warpage characteristics;
• and
• placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment is provided by an adjustable height button centered between all edges of the laminate substrate, the adjustable height button directly contacts a bottom surface of the laminate substrate.

A method, comprising:

• characterizing a laminate substrate for warpage characteristics by using one of room temperature techniques and elevated temperature techniques;
• determining a horizontal plane distortion based on the warpage characteristics;
• and
• placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment is provided by an adjustable height button located in a center of the laminate substrate as defined by the intersection of two diagonal lines extending from opposite corners, the adjustable height button directly contacts a bottom surface of the laminate substrate.