Semiconductor chip and semiconductor package having the same

A semiconductor chip, comprising:

• a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, wherein the semiconductor substrate is divided into a main region and a peripheral region surrounding the main region, wherein the circuit unit is disposed in the main region, wherein the circuit unit comprise a semiconductor memory device and a semiconductor logic device;
• and
• a girder beam formed within a portion of the semiconductor substrate outside of the circuit unit,
• wherein the girder beam comprises:
• longitudinal girders formed within the semiconductor substrate and extending in a longitudinal direction of the peripheral region;
• and
• lateral girders formed within the semiconductor substrate and connecting side walls of the longitudinal girders,
• wherein the longitudinal girder beam comprises:
• first longitudinal girders disposed in the peripheral region and extending in a longitudinal direction of the peripheral region;
• and
• second longitudinal girders disposed in the main region and extending in a direction parallel to the first longitudinal girders, and
• wherein the lateral girder beam comprises:
• first lateral girders disposed in the peripheral region and connecting side walls of the first longitudinal girders;
• and
• second lateral girders disposed in the main region and connecting side walls of the second longitudinal girders.