Package substrate with lateral communication circuitry

A package substrate, comprising:

• a first redistribution layer (RDL) configured according to a first design rule, and having:
• a first dielectric layer;
• and
• a first redistribution circuitry embedded in the first dielectric layer;
• wherein the first redistribution circuitry comprises a first left redistribution circuitry and a first right redistribution circuitry;
• a second redistribution layer (RDL) configured according to a second design rule and having:
• a second dielectric layer;
• and
• a second redistribution circuitry embedded in the second dielectric layer;
• wherein
• the second redistribution circuitry comprises a second left redistribution circuitry and a second right redistribution circuitry;
• the second left redistribution circuitry is configured on a bottom of the first left redistribution circuitry and electrically coupled to the first left redistribution circuitry;
• and
• the second right redistribution circuitry is configured on a bottom of the first right redistribution circuitry and electrically coupled to the first right redistribution circuitry;
• and
• a lateral communication circuitry configured according to the first design rule, in the first RDL and between the first left redistribution circuitry and the first right redistribution circuitry, wherein the lateral communication circuitry extends substantially parallel to a top surface of the second dielectric layer, wherein
• the lateral communication circuitry electrically couples the first left redistribution circuitry and the first right redistribution circuitry, and
• the second design rule has a lower circuitry density including a wider line width and a greater line thickness than those of the first design rule.