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US 9,543,247 B1Granted
Surface-mount electronic component
AssigneeSTMicroelectronics (Tours) SAS
InventorOlivier Ory
Life of this patent
Estimating the term…
Abstract
A surface-mount chip is formed by a silicon substrate having a front surface and a side. The chip includes a metallization intended to be soldered to an external device. The metallization has a first portion covering at least a portion of the front surface of the substrate and a second portion covering at least a portion of the side of the substrate. A porous silicon region is included in the substrate to separating the second portion of the metallization from the rest of the substrate.
Claims8
A surface-mount integrated circuit chip, comprising:
- a substrate having a front surface and a side;
- at least one metallization configured to be soldered to an external device, said at least one metallization comprising a first portion covering at least a portion of the front surface of the substrate and a second portion covering at least a portion of the side of the substrate;
- and
- a porous silicon region included in the substrate and separating the second portion of the metallization from a remainder of the substrate.
1 more element
An integrated circuit chip, comprising:
- a semiconductor substrate including an active area with circuits;
- a metal contact over the semiconductor substrate and in electrical connection with the circuits of the active area;
- a porous silicon region of the semiconductor substrate along a side edge of the semiconductor substrate;
- and
- a metal layer having a first portion in contact with the metal contact and having a second portion extending from the first portion onto the side edge of the semiconductor substrate and in contact with the porous silicon region.
2 more elements
Dependencies are inferred from the claim text.