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US 9,543,239 B2Granted
Semiconductor device and production method therefor
AssigneeRohm Co., Ltd.
InventorShoji Yasunaga
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor chip, a lead arranged on a side portion of the semiconductor chip, and a wire, whose one end and another end are bonded to the semiconductor chip and the lead respectively, having a ball portion and a stitch portion wedged in side elevational view on the semiconductor chip and the lead respectively. An angle of approach of the wire to the lead is not less than 50°, and the length of the stitch portion is not less than 33 μm.
Claims15
A semiconductor device, comprising:
- a semiconductor chip;
- leads arranged around the semiconductor chip;
- wires bonded to the semiconductor chip and the leads;
- an island to which the semiconductor chip is bonded;
- a chip bonding material interposed between the semiconductor chip and the island to bond the semiconductor chip and the island to each other;
- and
- a package covering a part of the island and the leads, wherein
- in a plan view, the island has a quadrangular shape having four sides that are each skewed relative to respective outer sides of the package,
- the island includes hanging portions which in the plan view, extend from respective corner portions of the island toward the respective outer sides of the package,
- in the plan view, each respective lead of the leads has a side opposed to a nearest one of the four sides of the island that is nearest to the respective lead out of the four sides of the island,
- a lower surface of one of the leads is arranged at a rear surface of the package, and in the plan view, the lower surface of the one of the leads has a pentagonal shape.
8 more elements
A semiconductor device, comprising:
- a semiconductor chip;
- leads arranged around the semiconductor chip;
- wires bonded to the semiconductor chip and the leads;
- an island to which the semiconductor chip is bonded;
- a chip bonding material interposed between the semiconductor chip and the island to bond the semiconductor chip and the island to each other;
- and
- a package covering a part of the island and the leads, wherein
- in a plan view, the island has a quadrangular shape having four sides that are each skewed relative to respective outer sides of the package,
- the island includes hanging portions,
- in the plan view, the hanging portions extend from respective corner portions of the island toward the respective outer sides of the package,
- in the plan view, each respective lead of the leads has a side opposed to a nearest one of the four sides of the island that is nearest to the respective lead out of the four sides of the island,
- a lower surface of one of the leads is arranged at a rear surface of the package, and
- in the plan view, the one of the leads is in a shape having five sides.
10 more elements
Dependencies are inferred from the claim text.