Back to results
US 9,543,238 B1Granted
Semiconductor device
AssigneeFitipower Integrated Technology, Inc.
InventorsShang-Cheng Yu, Chih-Nan Cheng
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a center semiconductor chip with a plurality of die pads, a plurality of lead frames, and a plurality of connecting components. The lead frame encapsulates the center semiconductor chip. Each connecting components establishes an electrical connection between the center semiconductor chip and the lead frame. At least one of the center semiconductor chip, the lead frame, and the connecting component forms an indicator.
Claims16
A semiconductor device comprising:
- a center semiconductor chip with a plurality of die pads;
- a plurality of lead frames configured to form a space to encapsulate the center semiconductor chip;
- a plurality of connecting components coupled to the center semiconductor chip, each of the connecting components configured to establish an electrical connection between the center semiconductor chip and the lead frame;
- and
- wherein an inductor is formed by at least one of the center semiconductor chip, the lead frames, and the connecting component being patterned.
2 more elements
A semiconductor device comprising:
- a center semiconductor chip with a plurality of die pads;
- a plurality of lead frames configured to form a space to encapsulate the center semiconductor chip;
- and
- a plurality of connecting components, each of the connecting component configured to establish an electrical connection between the center semiconductor chip and the lead frame;
- wherein at least one inductor is encapsulated inside the semiconductor device.
2 more elements
Dependencies are inferred from the claim text.