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US 9,543,237 B2Granted
Semiconductor package structure
AssigneeALi Corporation
InventorLo-Tien Feng
Life of this patent
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Abstract
A semiconductor package structure includes a lead frame, a chip and a molding compound. The lead frame includes a tray pad and a plurality of leads. Two of the leads are different in height positions. The chip is disposed on the tray. The molding compound encapsulates the chip and a portion of each lead.
Claims11
A semiconductor package structure connected to a circuit board, comprising:
- a lead frame, comprising:
- a tray;
- and
- a plurality of leads, wherein each lead has an inner lead, and two of the inner leads are different in height position;
- a chip disposed on the tray and electrically connected to the circuit board through a plurality of bonding wires and the plurality of leads;
- and
- a molding compound encapsulating the chip and the inner lead of each lead.
4 more elements
Dependencies are inferred from the claim text.