Semiconductor package and method therefor
AssigneeAmkor Technology, Inc.
InventorsHyung Il Jeon, Ji Young Chung, Byong Jin Kim, In Bae Park, Jae Min Bae, No Sun Park
Life of this patent
Estimating the term…
Abstract
In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width. The conductive bump is attached to the lead such that a portion of the conductive bump extends to at least partially surround a side surface of the lead. A molding compound resin encapsulates the electronic chip, the conductive bump, and at least a portion of the lead. The lead is configured so strengthen the joining force between the lead and conductive bump.
Claims20
A semiconductor package comprising:
- a lead;
- a semiconductor chip having a conductive bump disposed adjacent and overlapping a major surface of the semiconductor chip, wherein the major surface overlaps and faces the lead, and wherein the conductive bump is attached to the lead;
- and
- an encapsulating layer sealing the semiconductor chip, at least a portion of the lead, and the conductive bump, wherein a portion of the conductive bump extends beyond an upper surface of the lead and at least partially surrounds a surface area of a portion of the lead, and wherein the lead is at least partially exposed to the outside of the encapsulating layer.
A semiconductor package structure comprising:
- a lead having side surfaces, wherein at least one side surface has a concave portion;
- a semiconductor chip having a conductive bump on a major surface, wherein the conductive bump is attached to the lead, and wherein a portion of the conductive bump extends to at least partially surround the concave portion of the lead;
- and
- an encapsulating layer configured to cover the semiconductor chip, the conductive bump, and at least a portion of the lead.
A semiconductor package comprising:
- a lead frame comprising a first lead;
- a semiconductor chip having a conductive bump disposed adjacent and overlapping a major surface of the semiconductor chip, wherein the major surface overlaps and faces the lead, and wherein the conductive bump is coupled to the first lead, and wherein a portion of the conductive bump extends to at least partially surround side surfaces of the lead;
- and
- a molded encapsulating layer covering the semiconductor chip, the conductive bump, and at least portions of the lead frame, wherein a portion of the first lead is exposed to the outside of the molded encapsulating layer.
Dependencies are inferred from the claim text.