Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsKoichi Yoshimura, Kazuhiro Kurachi
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Abstract
A semiconductor device (10) includes a metallic base plate (22) provided with an upper surface (22a) and a lower surface (22b), a plurality of insulating substrates (24) provided on the upper surface (22a), and a plurality of semiconductor elements (26) and (28) mounted side by side on the respective insulating substrates (24). Annular grooves (50) and (52) for storing insulating grease are provided on the lower surface (22b) of the base plate (22). A surface (40a) of a cooling fin (40) is superimposed on the lower surface (22b) with insulating grease (42) interposed therebetween and insides of the annular grooves (50) and (52) are filled with the insulating grease (42).
Claims3
A semiconductor device comprising:
- a base plate having an upper surface and a lower surface;
- and
- a plurality of planar semiconductor elements provided side by side on the upper surface side,
- wherein the lower surface of the base plate is provided with a groove region where a plurality of grooves are continuously provided so as to spread and overlap with the plurality of semiconductor elements, grooves of the groove region in the center of the base plate are deeper than grooves of the groove region on distal end sides of the base plate.
Dependencies are inferred from the claim text.