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US 9,543,226 B1Granted
Heat sink for a semiconductor chip device
AssigneeCoriant Advanced Technology, LLC
InventorNathan A. Nuttall
Life of this patent
Estimating the term…
Abstract
A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.
Claims18
A semiconductor chip device comprising:
- a substrate including first and second sides, and an opening extending through the substrate between the first and second sides;
- first opto-electronic or electronic components mounted on the first and second sides;
- a heat sink mounted on the first surface in thermal contact with the components on the first side, and including an extension extending through the opening with an exposed surface parallel with the second side;
- and
- at least one second opto-electronic or electronic components mounted on the exposed surface of the extension;
- wherein the heat sink provides a first thermally-conductive path for the first components on the first side and each of the second components on the exposed surface.
3 more elements
A heat sink comprising:
- a base adapted to be mounted on a first side of a substrate;
- thermally conductive pins or fins extending from a first side of the base away from the substrate providing a first thermally conductive path;
- cavities extending into a second side of the base and adapted to receive opto-electronic or electronic components mounted on the first side of the substrate to physically and RF shield the opto-electronic or electronic components;
- and
- an extension extending from the second side of the base to extend through an opening in the substrate to a second side of the substrate.
2 more elements
Dependencies are inferred from the claim text.