Wafer die separation
AssigneeTexas Instruments Incorporated
InventorGenki Yano
Life of this patent
Estimating the term…
Abstract
A method of singulating a wafer starts with fracturing the wafer. The method may also include attaching the dicing tape sheet to a ring frame; relatively raising a portion of the dicing tape sheet supporting the wafer with respect to the ring frame; and attaching support tape to the ring frame and the dicing tape sheet.
Claims9
A method of singulating a wafer and separating die that are supported on a dicing tape sheet comprising:
- fracturing wafer to form a plurality of singulation lines dividing the wafer into a plurality of dies;
- attaching the dicing tape sheet to a ring frame;
- relatively raising a portion of the sheet supporting the wafer with respect to the ring frame;
- and
- attaching a plurality of radially extending strips of support tape to the ring frame and the dicing tape sheet.
A method of singulating a wafer and separating die that are supported on a dicing tape sheet comprising:
- fracturing wafer to form a plurality of singulation lines dividing the wafer into a plurality of dies;
- attaching the dicing tape sheet to a ring frame;
- relatively raising a portion of the sheet supporting the wafer with respect to the ring frame;
- and
- attaching support tape to the ring frame and the dicing tape sheet comprises attaching a plurality of chord wise extending strips of support tape to the ring frame and the dicing tape sheet.
A method of singulating a wafer and separating die that are supported on a dicing tape sheet comprising:
- fracturing wafer to form a plurality of singulation lines dividing the wafer into a plurality of dies;
- attaching the dicing tape sheet to a ring frame;
- relatively raising a portion of the sheet supporting the wafer with respect to the ring frame;
- and
- attaching a plurality of circumferentially extending strips of support tape to the ring frame and the dicing tape sheet.
Dependencies are inferred from the claim text.