Method of fabricating semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorSeung-Yeol Yang
Life of this patent
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Abstract
The method includes disposing semiconductor chips on a package substrate having sawing lines, forming an encapsulant to cover the semiconductor chips on the package substrate, forming a package assembly by a first curing of the encapsulant, forming first grooves by cutting the encapsulant along the sawing lines, performing a second curing of the encapsulant, and dividing the package assembly into unit semiconductor packages by cutting the package substrate along the sawing lines and forming second grooves to overlap the first grooves.
Claims20
A method of fabricating a semiconductor package, comprising:
- disposing semiconductor chips on a package substrate having sawing lines;
- forming a package assembly including forming an encapsulant to cover the semiconductor chips on the package substrate;
- performing a first curing of the encapsulant;
- cutting the encapsulant along the sawing lines to form first grooves;
- performing a second curing of the encapsulant;
- cutting the package substrate along the sawing lines to form second grooves after the performing a second curing, the second grooves overlapping the first grooves;
- and
- dividing the package assembly into unit semiconductor packages.
A method of fabricating a semiconductor package, comprising:
- disposing semiconductor chips on a package substrate having sawing lines;
- bonding the semiconductor chips to the package substrate;
- forming a package assembly including forming an encapsulant to cover upper and side surfaces of the semiconductor chips on the package substrate;
- performing a first curing of the encapsulant;
- cutting the package substrate along the sawing lines to form first grooves;
- performing a second curing of the encapsulant;
- forming external connection terminals under a lower surface of the package substrate;
- cutting the encapsulant along the sawing lines;
- to form second grooves after the performing a second curing, the second grooves overlapping the first grooves;
- and
- dividing the package assembly into unit semiconductor packages.
A method of fabricating a semiconductor package, comprising:
- disposing semiconductor chips on a package substrate;
- forming a package assembly including forming an encapsulant to cover the semiconductor chips on the package substrate;
- performing a first curing of the encapsulant;
- cutting a half of the package assembly;
- performing a second curing of the encapsulant;
- and
- dividing the package assembly into unit semiconductor packages after the performing a second curing.
Dependencies are inferred from the claim text.