Packaging process tools and systems, and packaging methods for semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu
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Abstract
Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.
Claims20
A packaging process tool for semiconductor devices, comprising:
- a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die, wherein the mechanical structure includes a low thermal conductivity material disposed thereon;
- and
- wherein the mechanical structure comprises a jig, the jig comprising a frame including a plurality of apertures adapted to retain a plurality of integrated circuit dies therein.
A packaging process tool for semiconductor devices, comprising:
- a mechanical structure for supporting a package substrate during a packaging process;
- and
- a jig coupleable to the mechanical structure, wherein the jig is adapted to cover the packaging substrate and the jig comprises a plurality of apertures for retaining a plurality of integrated circuit dies onto the packaging substrate, wherein the mechanical structure or the jig or both comprises a low thermal conductivity material disposed thereon.
A packaging process tool for semiconductor devices, comprising:
- a mechanical structure including
- a first support adapted to support a packaging substrate,
- a second support adapted to retain an integrated circuit die onto the packaging substrate,
- a low thermal conductivity material coating a major surface of the first support, the second support, or both the first and second support;
- and
- a heat source for directing heat toward the first support, the second support, or both the first and second support.
Dependencies are inferred from the claim text.