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US 9,543,175 B2Granted
Package assembly for thin wafer shipping and method of use
AssigneeInternational Business Machines Corporation
InventorsDamyon L. Corbin, Charles F. Musante
Life of this patent
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Abstract
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
Claims18
A package assembly comprising:
- a shipping container;
- a wafer container having a bottom surface and a plurality of straps attached thereto, placed within the shipping container;
- upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof;
- and
- a plurality of tabs extending from an outermost perimeter of the bottom surface and positioned between the bottom surface and the plurality of straps.
2 more elements
A package assembly, comprising:
- a wafer container comprising a bottom surface and a plurality of straps attached thereto;
- a stack of wafers interposed with ESD compliant material sheets positioned within the wafer container;
- a distribution plate positioned on a top side and bottom side of the stack of wafers, wherein the distribution plates are structured to:
- contain the stack of wafers as a unit;
- and
- distribute forces across a surface of the stack of wafers;
- and
- a plurality of tabs extending from an outermost perimeter of the bottom surface and positioned between the plurality of straps and the bottom surface.
5 more elements
Dependencies are inferred from the claim text.