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US 9,543,170 B2Granted
Semiconductor packages and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Jing-Cheng Lin, Po-Hao Tsai
Life of this patent
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Abstract
Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including forming a first die package, the first die package including a first die, a first electrical connector, and a first redistribution layer, the first redistribution layer being coupled to the first die and the first electrical connector, forming an underfill over the first die package, patterning the underfill to have an opening to expose a portion of the first electrical connector, and bonding a second die package to the first die package with a bonding structure, the bonding structure being coupled to the first electrical connector in the opening of the underfill.
Claims20
A method comprising:
- forming a first package comprising:
- forming a first dielectric layer on a carrier substrate;
- after forming the first dielectric layer on the carrier substrate, forming a first electrical connector on the first dielectric layer, the first electrical connector having a first end and a second end opposite the first end, the first dielectric layer separating the second end of the first electrical connector from the carrier substrate;
- attaching a first die adjacent the first electrical connector and over the first dielectric layer, a backside surface of the first die being proximate the first dielectric layer, an active surface of the first die being distal the first dielectric layer, the active surface of the first die being opposite the backside surface of the first die;
- forming a redistribution layer over the first die, the first electrical connector, the redistribution layer having a first side and a second side opposite the first side, the first end of the first electrical connector adjoining the first side of the redistribution layer;
- forming a second electrical connector over the second side of the redistribution layer, the second electrical connector being coupled to at least one of the first die and the first electrical connector;
- removing the carrier substrate to expose the first dielectric layer;
- and
- after removing the carrier substrate, removing the first dielectric layer to expose portions of the first die and the second end of the first electrical connector;
- bonding a second package to the first package with a bonding structure, the bonding structure being coupled to and adjoining the second end of the first electrical connector;
- and
- forming an underfill between the first package and the second package.
9 more elements
A method comprising:
- forming a first die package, the first die package comprising a first die, a first electrical connector, and a first redistribution layer, the first redistribution layer being coupled to the first die and the first electrical connector, an active surface of the first die being proximate the first redistribution layer, a backside surface of the first die being distal the first redistribution layer, the active surface of the first die being opposite the backside surface of the first die, a molding material at least laterally encapsulating the first die and the first electrical connector, surfaces of the molding material being level with the active surface and the backside surface of the first die;
- forming an underfill over the first die package, the backside surface of the first die being proximate the underfill, the active surface of the first die being distal the underfill;
- patterning the underfill to have an opening to expose a portion of the first electrical connector;
- and
- bonding a second die package to the first die package with a bonding structure, the bonding structure being coupled to the first electrical connector, the bonding structure being in the opening of the underfill.
2 more elements
A method comprising:
- forming a first package comprising:
- forming a first electrical connector over a carrier substrate;
- attaching a first die adjacent the first electrical connector and over the carrier substrate, a backside surface of the first die being proximate the carrier substrate and an active surface of the first die being distal the carrier substrate, the active surface of the first die being opposite the backside surface of the first die;
- encapsulating the first die and the first electrical connector with a molding material;
- grinding the molding material to expose a surface of first electrical connector and the active surface of the first die, wherein after the grinding, a surface of the molding material is level with the exposed surface of the first electrical connector and the active surface of the first die;
- forming a redistribution layer over the first die, the first electrical connector, and the molding material;
- forming a second electrical connector over the redistribution layer, the second electrical connector being coupled to at least one of the first die and the first electrical connector;
- after the forming the second electrical connector, removing the carrier substrate;
- and
- bonding a second package to the first package with a bonding structure, the second package comprising one or more dies, the bonding structure being coupled to the first electrical connector, wherein after the bonding the second package to the first package with the bonding structure, the first die being between the redistribution layer and the second package;
- forming an underfill between the first package and the second package;
- and
- singulating the first package and the second package from adjacent packages to form a semiconductor package, the semiconductor package comprising the first package and the second package.
10 more elements
Dependencies are inferred from the claim text.