Back to results
US 9,543,166 B2Granted
External gettering method and device
AssigneeMicron Technology, Inc.
InventorsMichael Tan, Cheng P. Pour
Life of this patent
Estimating the term…
Abstract
Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
Claims16
A method of providing gettering to a semiconductor device, the method comprising:
- providing a first semiconductor substrate, the first semiconductor substrate comprising a front side, a backside opposite the front side, a first section at the front side for forming semiconductor devices, and a second section at the backside;
- performing a stress-relief process at the backside of the first semiconductor substrate;
- and
- applying an external gettering element adjacent to the second section of the first semiconductor substrate, the external gettering element comprising:
- a first gettering material, the first gettering material including an additive which provides the first gettering material with ions, the ions provided by the additive having the property of attracting ions and/or contaminants contained within the first semiconductor substrate away from the front side, and an adhesive material configured to adhere the first gettering material to the stress-relieved backside of the first semiconductor substrate.
2 more elements
Dependencies are inferred from the claim text.