Method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, comprising the steps of:

• preparing a semiconductor substrate having a first main surface and a second main surface opposite to each other;
• preparing a ring frame;
• attaching and holding an adhesive tape on said ring frame;
• fixing said semiconductor substrate on said adhesive tape at said first main surface;
• pressing, by a pressing member, a main surface of said adhesive tape opposite to a side holding said semiconductor substrate in an axial direction of said ring frame;
• after fixing said semiconductor substrate on said adhesive tape, grinding said second main surface of said semiconductor substrate;
• after grinding said second main surface of said semiconductor substrate, placing said semiconductor substrate fixed on said adhesive tape, in an accommodating chamber;
• exhausting a gas from said accommodating chamber while maintaining a temperature of said adhesive tape at 100° C. or more;
• reducing a temperature of said semiconductor substrate after the step of exhausting the gas from said accommodating chamber;
• and
• forming an electrode on said second main surface of said semiconductor substrate after the step of reducing the temperature of said semiconductor substrate,
• in the step of pressing, by said pressing member, said main surface in the axial direction of said ring frame, said adhesive tape being elastically deformed to deviate said second main surface from a location surrounded by an inner circumference surface of said ring frame.