Ionizer and substrate transfer system having the same, and method of manufacturing a semiconductor device using the same

A method of manufacturing a semiconductor device, the method including:

• providing a substrate to a transfer chamber of a transfer apparatus;
• moving the substrate in the transfer chamber;
• while moving the substrate in the transfer chamber, spraying ionized gas toward the substrate using an ionizer, the ionizer including:
• a body having a gas supply chamber for supplying gas,
• an ion spraying cap installed in a lower portion of the body and having a spray hole in fluid communication with the gas supply to spray a gas supplied from the gas supply to the outside of the ionizer and an electrode needle disposed within the spray hole to generate a corona discharge and generate ionized gas, and
• a pair of first and second guiding plate portions disposed on opposite sides of the ion spraying cap and extending downward from the lower portion of the body respectively to guide the ionized gas sprayed from the spray hole to be directed toward the substrate;
• transferring the substrate to a process chamber;
• performing a fabrication process on the substrate while it is in the process chamber;
• and
• forming a semiconductor device from the processed substrate.